The KOHYOUNG Solder Paste Inspection (SPI) unit is the newest equipment addition to the SMT line. The SPI inspects for correct stencil design, measurement of board warp, solder paste application, and coplanarity from the screen printer. The SPI inspects every board from the screen printer, and any defect is quickly identified. The average amount of defects from the screen printer is 85%. The equipment additions will ensure Burton can stay productive, flexible with production schedules, and keep up with demand from current and future customers.

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